cystech electronics corp. spec. no. : c363c3 issued date : 2011.12.08 revised date : page no. : 1/6 DTC124EC3 cystek product specification npn digital transistors (built-in resistors ) DTC124EC3 features ? built-in bias resistors enable the configuration of an inverter circu it without connecting external input resistors (see equi valent circuit). ? the bias resistors consist of thin -film resistors with complete isolat ion to allow negative biasing of the input. they also have the advantage of almost completely eliminating parasitic effects. ? only the on/off conditions need to be set for operation, making device design easy. ? complements the dta124ec3 ? pb-free lead plating and halogen-free package equivalent circuit outline sot-523 DTC124EC3 r1=22k , r2=22 k in(b) : base out(c) : collector gnd(e) : emitter absolute maximum ratings (ta=25 ) parameter symbol limits unit supply voltage vcc 50 v input voltage vin -10~+40 v io 30 ma output current io(max.) 100 ma power dissipation pd 150 mw thermal resistance, junction to ambient r ja 833 c/w junction temperature tj 150 c storage temperature tstg -55~+150 c
cystech electronics corp. spec. no. : c363c3 issued date : 2011.12.08 revised date : page no. : 2/6 DTC124EC3 cystek product specification electrical characteristics (ta=25 ) parameter symbol min. typ. max. unit test conditions vi(off) - - 0.5 v vcc=5v, io=100ua input voltage vi(on) 3 - - v vo=0.2v, io=5ma output voltage vo(on) - 0.1 0.3 v io/ii=10ma/0.5ma input current ii - - 0.36 ma vi=5v output current io(off) - - 0.5 a vcc=50v, vi=0v dc current gain gi 56 - - - vo=5v, io=5ma input resistance r 1 15.4 22 28.6 k - resistance ratio r 2 /r 1 0.8 1 1.2 - - transition frequency f t - 250 - mhz v ce =10v, i c =5ma, f=100mhz* * transition frequency of the device ordering information device package shipping marking DTC124EC3 sot-523 (pb-free lead plating an d halogen-free package) 3000 pcs / tape & reel 8b
cystech electronics corp. spec. no. : c363c3 issued date : 2011.12.08 revised date : page no. : 3/6 DTC124EC3 cystek product specification typical characteristics dc current gain vs output current 1 10 100 1000 0.1 1 10 100 output current---io(ma) current gain--- hfe vo=5v output voltage vs output current 10 100 1000 1 10 100 output current ---io(ma) output voltage---vo(on)(mv) io/ii=20 input voltage vs output current (on characteristics) 0.1 1 10 0.1 1 10 100 output current --- io(ma) input voltage --- vi(on)(v) vo=0.2v output current vs input voltage (off characteristics) 0.1 1 10 0.1 1 10 input voltage --- vi(off)(v) output current --- io(ma) vcc=5v power derating curve 0 20 40 60 80 100 120 140 160 0 50 100 150 200 ambient temperature --- ta( ) power dissipation---pd(mw)
cystech electronics corp. spec. no. : c363c3 issued date : 2011.12.08 revised date : page no. : 4/6 DTC124EC3 cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c363c3 issued date : 2011.12.08 revised date : page no. : 5/6 DTC124EC3 cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c363c3 issued date : 2011.12.08 revised date : page no. : 6/6 DTC124EC3 cystek product specification sot-523 dimension *: typical inches millimeters inches millimeters dim min. max. min. max. style: pin 1.base (input) 2.emitter (ground) 3.collector (output) 3-lead sot-523 plastic surface mounted package cystek package code: c3 marking: 8b dim min. max. min. max. a 0.028 0.035 0.700 0.900 e 0.028 0.035 0.700 0.900 a1 0.000 0.004 0.000 0.100 e1 0.057 0.069 1.450 1.750 a2 0.028 0.031 0.700 0.800 e 0.020* 0.500* b1 0.006 0.010 0.150 0.250 e1 0.035 0.043 0.900 1.100 b2 0.010 0.014 0.250 0.350 l 0.016 ref 0.400 ref c 0.004 0.008 0.100 0.200 l1 0.010 0.018 0.260 0.460 d 0.059 0.067 1.500 1.700 0 8 0 8 notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead: pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0 important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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